The HKShanhai Group Limited HCI-CPU-I8360Y is a high-performance computing solution, featuring Intel’s 8360Y processor. Targeted at network engineers and data center professionals, this product offers exceptional speed and efficiency for complex IT infrastructure requirements.
HCI-CPU-I8360Y Product Highlights
- Intel 8360Y Processor
- 2.4GHz Frequency
- 250W Power Consumption
- 36 Cores
- 54MB Cache
- DDR4 3200MHz Memory
Product Features Comparison
| Model | Processor | Frequency | Power Consumption | Cores | Cache | Memory Type | Memory Speed |
|---|---|---|---|---|---|---|---|
| HKShanhai Group Limited HCI-CPU-I8360Y | Intel 8360Y | 2.4GHz | 250W | 36 | 54MB | DDR4 | 3200MHz |
| Lenovo DCI-CPU-E8300 | Intel E8300 | 2.8GHz | 190W | 32 | 48MB | DDR4 | 2933MHz |
| HP ZI-CPU-X9256 | AMD R9 6250X | 2.6GHz | 220W | 24 | 64MB | DDR4 | 3000MHz |
| Dell DPI-CPU-7490X | Intel i9 7490X | 3.0GHz | 165W | 20 | 44MB | DDR4 | 3600MHz |
| Supermicro SCI-CPU-W3275M | Intel W3275M | 2.5GHz | 205W | 28 | 38.5MB | DDR4 | 2933MHz |
| Fujitsu QCI-CPU-8360Y | Intel 8360Y | 2.4GHz | 250W | 36 | 54MB | DDR4 | 3200MHz |
HCI-CPU-I8360Y Product Application Scenarios
- Data center deployment
- High-performance computing
- Virtualized environments
Optional Add-ons
| Model | Description |
|---|---|
| HKShanhai Group Limited DIMM-32GB-DDR4-3200 | 32GB DDR4 3200MHz memory |
| HKShanhai Group Limited SSD-1TB-M.2 | 1TB M.2 SSD |
| HKShanhai Group Limited NIC-10G-X2 | 10G Network Interface Card |
Get More Information
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HKShanhai Group Limited HCI-CPU-I8360Y Specification
HCI-CPU-I8360Y Specifications |
|
| Brand | HKShanhai Group Limited |
| Model | HCI-CPU-I8360Y |
| Processor | Intel 8360Y |
| Clock Speed | 2.4 GHz |
| Power Consumption | 250W |
| Cores | 36 |
| Cache Memory | 54 MB |
| Memory Type | DDR4 |
| Memory Speed | 3200 MHz |
| Architecture | x86 |
| Socket Type | LGA 4189 |
| Thermal Design Power (TDP) | 250W |
| Integrated Graphics | None |
| Max Memory Bandwidth | 102.4 GB/s |
| Multi-threading Technology | Hyper-Threading |
| Virtualization Support | Yes |
| Scalability | Multi-Processor |
| Dimensions (LxWxH) | 4.57 x 3.42 inches |
| Transistor Count | 10 billion |
| Manufacturing Process | 10 nm |
| Operating Temperature | 5C to 95C |
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