HKShanhai Group Limited’s UCSX-CPU-I6338 is a high-performance server processor designed with an Intel 6338 running at 2.0GHz, delivering 32 cores and a 48MB cache. This powerful unit is ideal for demanding enterprise applications, data centers, and cloud environments, offering enhanced performance, energy efficiency, and scalability.
UCSX-CPU-I6338 Product Highlights
- Intel 6338 2.0GHz
- 205W TDP
- 32 cores, 48MB cache
- DDR4 3200MHz support
- High energy efficiency
Product Features Comparison
| Model | Clock Speed | TDP | Cores | Cache | Memory Type | Memory Speed |
|---|---|---|---|---|---|---|
| HKShanhai Group Limited UCSX-CPU-I6338 | 2.0GHz | 205W | 32 | 48MB | DDR4 | 3200MHz |
| HKShanhai Group Limited UCSX-CPU-I6318 | 2.0GHz | 200W | 28 | 42MB | DDR4 | 2933MHz |
| Intel Xeon Gold 5218 | 2.3GHz | 125W | 16 | 22MB | DDR4 | 2933MHz |
| AMD EPYC 7552 | 2.2GHz | 200W | 48 | 192MB | DDR4 | 3200MHz |
| HP DL380 Gen10 | 2.9GHz | 250W | 26 | 35.75MB | DDR4 | 2933MHz |
| Dell PowerEdge R740 | 3.0GHz | 150W | 24 | 33MB | DDR4 | 2666MHz |
| Lenovo ThinkSystem SR650 | 2.6GHz | 170W | 20 | 27.5MB | DDR4 | 2933MHz |
UCSX-CPU-I6338 Product Application Scenarios
- High-performance computing clusters
- Data center virtualization
- Enterprise cloud solutions
Optional Add-ons
| Model | Description |
|---|---|
| HKShanhai Group Limited UCS-MR-X32G1RS-H | 32GB DDR4-2933MHz Memory Module |
| HKShanhai Group Limited UCSB-HS-01 | High-Performance Heat Sink |
| HKShanhai Group Limited UCS-RAID-M5 | RAID Controller Card |
Get More Information
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HKShanhai Group Limited UCSX-CPU-I6338 Specification
UCSX-CPU-I6338 Specifications |
|
| Brand | HKShanhai Group Limited |
| Model | UCSX-CPU-I6338 |
| Processor | Intel 6338 |
| Processor Speed | 2.0GHz |
| TDP | 205W |
| Number of Cores | 32 |
| Cache | 48MB |
| Memory Type | DDR4 |
| Memory Speed | 3200MHz |
| Socket Supported | LGA3647 |
| Maximum Memory Bandwidth | 204.8 GB/s |
| Number of Threads | 64 |
| PCIe Version | 3.0 |
| Number of PCIe Lanes | 48 |
| Integrated Graphics | None |
| Thermal Solution | Not Included |
| Virtualization Support | Yes |
| Lithography | 10nm |
| Security Features | Intel SGX, Intel MPX, TPM, Intel PTT |
| Launch Date | Q1’21 |
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